Предназначены для использования в магнитофонах, электрофонах, телевизионных и радиоприемниках, другой аудиоаппаратуре высокого класса. Типовая схема подключения приведена на рисунке 3. В микросхемы встроена защита выхода от короткого замыкания в нагрузке и термозащита. На микросхемах TDA, TDA можно собрать двухканальные усилители низкой частоты, по мостовой схеме данные микросхемы не будут работать - будьте внимательны!

Author:JoJosho Akijin
Language:English (Spanish)
Published (Last):7 March 2008
PDF File Size:3.19 Mb
ePub File Size:6.79 Mb
Price:Free* [*Free Regsitration Required]

The device is primarily developed for car radio applications. Stereo or BTL application? High output power? Low offset voltage at output important for BTL? Fixed gain? Good ripple rejection? Load dump protection? Thermally protected? Reverse polarity safe? Protected against electrostatic discharge? Low thermal resistance? Identical inputs inverting and non-inverting?

Compatible with TDAB except output power. V0 Tc? The gain of each amplifier is fixed at 40 dB. Mute condition. V 6. UNIT V mV? UNIT 2 V ? W 10 11? Hz 20? Vno rms? Hz 45? V ? V Notes to the characteristics 1. At Output power is measured directly at the output pins of the IC.

Frequency response externally fixed. Ripple rejection measured at the output with a source impedance of 0? Frequency between 1 kHz and 10 kHz. Frequency between Hz and 10 kHz. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. May Fig. A2 b max. Plastic or metal protrusions of 0. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities.

In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints Apply a low voltage soldering iron less than 24 V to the lead s of the package, below the seating plane or not more than 2 mm above it.

This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains? Stress above one or more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speci? Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the speci?

Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.




Features Built-in bias resistors Reduces component count Simplifies circuit design Red BTAXC : Three quadrant triacs high commutation Passivated high voltage, high commutation triac in a full pack, plastic package. BAF :. The circuit is comprised of a playback preamplifier, a line amplifier, a recording amplifier, an ALC circuit and high-voltage head switch. The IC has a built-in coil equivalent circuit for recording equalization, which eliminates the need for an external component. Camcorder Time-lapse Control. LM : Single Channel.


Circuito integrado TDA1519A



TDA1519A NXP Semiconductors, TDA1519A Datasheet


Related Articles